WIRE BONDING IN MICROELECTRONICS, 3/E; George Harman; 2010
WIRE BONDING IN MICROELECTRONICS, 3/E; George Harman; 2010

WIRE BONDING IN MICROELECTRONICS, 3/EUpplaga 3

av George Harman

  • Upplaga: 3e upplagan
  • Utgiven: 2010
  • ISBN: 9780071476232
  • Sidor: 446 st
  • Förlag: McGraw Hill
  • Format: Inbunden
  • Språk: Engelska

Om boken

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The Industry Standard Guide to Wire Bonding--Fully Updated the definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation cd includes all of the book's full-color figures plus animations.

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Mer om WIRE BONDING IN MICROELECTRONICS, 3/E (2010)

I mars 2010 släpptes boken WIRE BONDING IN MICROELECTRONICS, 3/E skriven av George Harman. Det är den 3e upplagan av kursboken. Den är skriven på engelska och består av 446 sidor. Förlaget bakom boken är McGraw Hill.

Köp boken WIRE BONDING IN MICROELECTRONICS, 3/E på Studentapan och spara pengar.

Referera till WIRE BONDING IN MICROELECTRONICS, 3/E (Upplaga 3)

Harvard

Harman, G. (2010). WIRE BONDING IN MICROELECTRONICS, 3/E. 3:e uppl. McGraw Hill.

Oxford

Harman, George, WIRE BONDING IN MICROELECTRONICS, 3/E, 3 uppl. (McGraw Hill, 2010).

APA

Harman, G. (2010). WIRE BONDING IN MICROELECTRONICS, 3/E (3:e uppl.). McGraw Hill.

Vancouver

Harman G. WIRE BONDING IN MICROELECTRONICS, 3/E. 3:e uppl. McGraw Hill; 2010.